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Topic:Kingtronics Six Methods to Avoid PCB Board Bending and Warping After Reflow Furnace
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The PCB is prone to bending and warping when it passes through the reflow furnace, which makes people very distressed. So how to prevent PCB board from bending and warping through the reflow furnace? Let's explain it to you:1.Reduce the influence of temperature on PCB stressSince "temperature" is the main source of plate stress, as long as the temperature of the reflow furnace is reduced or the heating and cooling rate of the plate in the reflow furnace is slowed down, the occurrence of plate bending and plate warping can be greatly reduced. However, there may be other side effects, such as solder short circuit.2.Use high Tg plateTg is the glass transition temperature, that is, the temperature at which the material changes from glass to rubber. The lower the Tg value of the material, the faster the plate begins to soften after entering the reflow furnace, and the longer the time to become soft rubber, the more serious the deformation of the plate. The use of plates with highe
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