Guest

Topic:Kt Kingtronics Contrast between GPP (Glass Passivated) and OJ (Pickling) of TVS Devices
Content:
1. Construction: (Figure 1) OJ structure(FIG. 2) GPP structure2. Process:Protection of the biggest differences between the two products in the PN junction.OJ structure of the product, the use of glue to protect knot, then at 200 degrees temperature curing. P-N junction obtain protection voltage.GPP structure of the product, the chip PN junction is under the protection of the passivation glass, sintered glass frit is 800 degrees around the melting, the glass layer is formed after cooling. This glass layer and melt into one chip, can not be separated by mechanical means.And OJ protection glue, just covering the PN junction surface.3. Feature Comparison:1) due to the different structure, when external stress (for example, were angled handle), thermal shock devices, under the plastic package if there is leakage, so the situation. OJ products, the
[<<][[1]][2][3][>>]

Browse comment(0)
Post comment



First page